UV electronic solder joint protection glue

◇Features:
Good adhesion to general substrates;
The adhesive layer is anti-vibration and stable;
Glue is thixotropic, which is good for sizing;
Good weather resistance;
Good bending resistance.
◇Application:
This product is specially designed for the protection of solder joints of electronic components. It has the characteristics of good adhesion, good toughness, strong shock resistance and good weather resistance. And the glue has a certain thixotropy which is very helpful for construction.
◇Physical properties: glue performance
Appearance: light yellow transparent viscous body
Viscosity: 10000～12000mPa·s
Electronic viscosity meter 4#12@25℃)
Solvent content %0
  
◇Curing conditions
The following data is measured under the condition that the intensity of the electrodeless mercury lamp is 120mw/cm²:
Tack-free time (s) 10
Deep curing time (1mm, s) 3
Full curing energy 800mj/cm²
Physical and chemical properties
Measured after curing in the electrodeless mercury lamp with a cumulative energy of 1200mj/cm²:
Hardness (Shore D) 70±2
Electrical properties
Volume resistance 8.3×1012
Bonding performance
The following data is measured after curing with an electrodeless mercury lamp with a cumulative energy of 1200mj/cm²:

Weather resistance test

The following data is measured after curing with an electrodeless mercury lamp with a cumulative energy of 1200mj/cm²: